MetroFrame · metrology

Wafer adapters for metrology

MetroFrame addresses the handling interface between a smaller substrate and a metrology tool. The measurement method, substrate geometry and instrument interfaces define the requirements.

Discuss your requirements

MetroFrame adapter in a cleanroom application

AI-modified

Instrument requirements

CD-SEM, sheet-resistance measurements and defect inspection have different placement, contact and handling requirements. The target instrument and measurement method guide the adapter review.

Loading and handling

The handling sequence includes the cassette, robot, chuck, alignment, loading and unloading. Measurement surfaces and restricted contact areas are part of the review.

Technical requirements

Placement tolerance, repeatability, contact restrictions and acceptance criteria define the evaluation for the chosen configuration.

Cassette and interface detail

The photographed assembly sits in a cassette slot. Cassette geometry, robot handoffs and chuck interfaces are assessed together for the target equipment—not assumed to be interchangeable.

Full front view of a red cassette with circular assemblies and visible carrier slots — Full view of the photographed cassette configuration.

Adapter assembly in the lower cassette slot, with circular parts above — Adapter in a cassette slot, detail view.

Details for a metrology inquiry

Substrate material, geometry and contact restrictions
Target instrument and measurement method
Placement and repeatability requirements
Cassette, robot and chuck interfaces
Acceptance criteria and required results

What we need to check

The adapter is matched to your substrate, tool and process. We review the interfaces, operating conditions and acceptance requirements for your application.
Technical area	Details for your application
Substrate	Material, diameter or shape, thickness and contact restrictions
Target equipment	Tool model, carrier format, cassette, robot and chuck interfaces; required changes
Placement and fixation	Alignment method, placement tolerance and retention through the intended sequence
Process conditions	Relevant chemistry, concentration, temperature, exposure time, rotation or vacuum conditions
Handling	Loading, unloading, manual or automated handoffs and contamination requirements
Acceptance	Acceptance criteria and required test results

Before you contact us

Explore application notes for metrology and wet-process development.

Wet-process development

Discuss your application

Tell us about your substrate and target tool. If several tools are involved, list the process steps.

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Technical details (optional)

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