Loadport and alignment
Equipment interfaces define how substrates and adapters enter the cell and are aligned.
Platform concept
Adaptive Tool Platform for wafer handling and inline metrology
ATP is a platform concept for bringing adapter loading, alignment, robot handling and measurement stations together. We develop the layout around the substrate, equipment and measurements your project needs.
Concept visualization
Handling and measurement, planned together
The platform concept connects adapter handling with measurement stations. The layout is developed around the substrate, equipment sequence and measurement task.
Building blocks
Plan the handling cell around the task
These design areas define the platform concept for an application.
Adapter loading and fixation
The adapter design determines substrate loading, fixation and removal requirements.
Robot and station layout
Transfer paths and station positions are developed around the handling and measurement tasks.
Measurement integration
Instrument placement, access and vibration requirements inform the layout.
Data and factory interfaces
Measurement data, status information and factory connections are part of the integration review.
Metrology module categories
Measurement modules
Module options are evaluated against the measurement goals and integration requirements.
Optical inspection
Surface features and local defects
Spectral imaging
Material contrast and process-state signals
Thickness measurement
Layer thickness and film-uniformity indicators
Topography and wafer shape
Surface profile, wafer bow and deformation
Particle checks
Particle and contamination inspection
Carrier environment checks
Mass-change checks and controlled carrier handling
Example application areas
Application areas to explore
These application questions guide the choice of measurements during concept development.
Small-substrate handling
Evaluate how smaller substrates move through existing equipment with adapter-based handling.
Scatterometry
Explore inline measurements for model comparison.
Layer and material analysis
Select optical, spectral, thickness or topography measurements for the process steps.
Stress, bow and defects
Connect deformation and local-defect data with process outcomes.
Overlay-risk inputs
Use stress and deformation data as potential inputs for overlay analysis.
RDL and bump inspection
Measure packaging-relevant geometry and surface conditions.
CMP characterization
Track topography and film-response measurements across polishing windows.
Etch and deposition
Correlate inline measurements with process-state changes.