Your existing tools. New substrates.
Wafer adapters for smaller substrates on existing tools
Forge42 develops wafer adapters and mechanical substrate carriers for smaller wafers and special substrates on existing semiconductor equipment. The WaferAdapter family is configured per substrate, tool and process: from a single metrology step to a connected process chain.
DIW rinse and spin-dry
DIW rinse and spin-dry · SU3200 · 2500 rpm
2024 · 24-second edited test excerpt.
Playback and sequence details
Normal-speed playback. Watch 18–20 s for visible color changes on the wafer surface.
- 0–4 s: Initial view of the carrier and substrate.
- 4–10 s: DIW rinse.
- 10–18 s: Spin-dry at the documented 2500 rpm setting.
- 18–20 s: Visible color changes on the wafer surface.
- 20–24 s: Spin-down and final view of the substrate in the adapter on the chuck.
How it works
The adapter bridges substrate and tool
A wafer adapter provides a handling format for a smaller substrate. The MetroFrame drawing shows the substrate within the adapter and its larger outer format.
- 150 mm substrate
- MetroFrame adapter
- 200 mm handling format
Handling suited to the process
Handling is matched to the substrate, adapter and process.
Semi-automatic wafer handling
Wafer and adapter are loaded manually. Actuating the tool positions the wafer in the adapter.
AI-modifiedManual handling with tweezers
Handling tools, contact areas and the loading sequence are considered together when designing the configuration.
AI-modifiedAutomated handling with the Adaptive Tool Platform
ATP is a platform concept for adapter loading, alignment, robot handling and metrology. Integration is developed around the target equipment and process.
WaferAdapter family
Adapter types for different applications
Choose the application closest to your project.
Product photos and drawings
150 mm → 200 mm
AI-modifiedMetroFrame for metrology: 150 mm substrates in a 200 mm handling format.
200 mm → 300 mm
AI-modified
FlexFrame: 200 mm substrates in a 300 mm handling format.
2″ → 200 mm
AI-modified
MetroFrame for metrology: 2-inch substrates in a 200 mm handling format.
What we need to check
The adapter is matched to your substrate, tool and process. We review the interfaces, operating conditions and acceptance requirements for your application.
| Technical area | Details for your application |
|---|---|
| Substrate | Material, diameter or shape, thickness and contact restrictions |
| Target equipment | Tool model, carrier format, cassette, robot and chuck interfaces; required changes |
| Placement and fixation | Alignment method, placement tolerance and retention through the intended sequence |
| Process conditions | Relevant chemistry, concentration, temperature, exposure time, rotation or vacuum conditions |
| Handling | Loading, unloading, manual or automated handoffs and contamination requirements |
| Acceptance | Acceptance criteria and required test results |
Wafer adapters and pocket wafers
A wafer size adapter acts as a wafer carrier, providing the outer handling format for a smaller substrate. Pocket wafers typically support the substrate in a recessed carrier surface; mechanical wafer adapters use a different support and retention approach. The choice depends on substrate geometry, contact restrictions and process conditions.
From one tool to a connected process chain
Your project can start on a single tool and expand step by step. Automated clamping, high-speed rotation and wet chemistry are often where multi-step process chains break—the WaferAdapter family is developed along those exact steps.
Wafer adapters in a measurement setup
Inspection criteria follow the substrate, adapter interfaces and target equipment. The measurement setup and acceptance criteria are agreed for each configuration.
AI-modifiedBefore you contact us
Explore application notes for metrology and wet-process development.