FlexFrame · development

Wafer adapters for wet-process development

FlexFrame is the wet-process development type for cleaning, rinsing and stripping. Suitability requires evaluation of the requested chemistry, exposure conditions and handling sequence.

Discuss your requirements

DIW rinse and spin-dry

DIW rinse and spin-dry · SU3200 · 2500 rpm

Normal-speed playback. Watch 18–20 s for visible color changes on the wafer surface.

2024 · 24-second edited test excerpt.

Playback and sequence details

0–4 s: Initial view of the carrier and substrate.
4–10 s: DIW rinse.
10–18 s: Spin-dry at the documented 2500 rpm setting.
18–20 s: Visible color changes on the wafer surface.
20–24 s: Spin-down and final view of the substrate in the adapter on the chuck.

Download the excerpt (normal speed)

Chemistry and operating conditions

Concentration, temperature and exposure time describe the chemical conditions. Rinsing, drying, rotation and contact restrictions complete the process requirements.

Loading and transfer

Manual loading, robot handling and automatic fixation have different interface requirements. The study covers how the substrate enters and leaves the adapter and process equipment.

Evaluation for the application

The evaluation covers each relevant process step, the adapter configuration and the required test results. Changes to material or operating conditions may require further assessment.

Details for a wet-process study

Chemistry, concentration, temperature and exposure time
Substrate and adapter contact restrictions
Rinse, dry, rotation and transfer sequence
Contamination and particle requirements
Planned evaluation and acceptance criteria

What we need to check

The adapter is matched to your substrate, tool and process. We review the interfaces, operating conditions and acceptance requirements for your application.
Technical area	Details for your application
Substrate	Material, diameter or shape, thickness and contact restrictions
Target equipment	Tool model, carrier format, cassette, robot and chuck interfaces; required changes
Placement and fixation	Alignment method, placement tolerance and retention through the intended sequence
Process conditions	Relevant chemistry, concentration, temperature, exposure time, rotation or vacuum conditions
Handling	Loading, unloading, manual or automated handoffs and contamination requirements
Acceptance	Acceptance criteria and required test results

Before you contact us

Explore application notes for metrology and wet-process development.

MetroFrame and metrology

Discuss your application

Tell us about your substrate and target tool. If several tools are involved, list the process steps.

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